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CEVA Press Releases

Recent CEVA press releases are listed below. To access the press release archive, click on the link to the appropriate year below.

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Archives: 2009 / 2008 / 2007 / 2006 / 2005 / 2004 / 2003 / 2002 / 2001 / 2000 / 1999 / 1998

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2003 Archives

Dec 16, 2003
CEVA Sharpens Focus on Digital Signal Processors, Updates Q4 Guidance, and Targets Profitability in 2004

Dec 15, 2003
Spreadtrum Commences Shipments Of GSM/GPRS Chip Powered By CEVA-TeakLite DSP Core To Chinese Market
Spreadtrum Extends Partnership With CEVA By Licensing The CEVA-Teak DSP Core To Power Chips for Next Generation 3G Standard

Dec 15, 2003
Broadcom Utilizes CEVA DSP Core To Power Edge Cellular Solution

Dec 8, 2003
CEVA Announces Launch And Licensing Of Pioneering CEVA-X DSP Architecture
First CEVA-X Core Licensed By World Leading Cellular Manufacturer To Power Their Next-Generation 3G Multimedia Phones

Dec 8, 2003
ParthusCeva Changes Name to CEVA, Inc.
Re-branding Reflects Strategy To Focus On DSP Cores And Related Applications; Coincides With Launch And Licensing Of New CEVA-X DSP Architecture

Nov 24, 2003
ParthusCeva, Inc. to Change Name to CEVA, Inc.
Re-branding Underpins Strategy To Focus on DSP Cores And Related Applications; Change Will Coincide With Launch Of New CEVA-X DSP Architecture

Oct 21, 2003
VIA Telecom Licenses ParthusCeva TeakLite DSP Core to Power Next Generation 2.5G and 3G Wireless Modems
VIA Telecom to Embed TeakLite in Cellular Systems on Chip

Oct 21, 2003
ParthusCeva Announces Results for the Third Quarter Ended September 30, 2003

Oct 17, 2003
ParthusCeva Announces Appointment of Chief Financial Officer and Vice-President of Business Development & Strategy
Appointments complete the transition of ParthusCeva executive management to San Jose Headquarters

Oct 7, 2003
Innochip Launches Digital Audio Broadcast Chip Powered by ParthusCeva's Teak DSP Core
New 0.18 micron ASIC Chip Now Available for Digital AM/FM Radio Systems

Oct 2, 2003
ParthusCeva Third Quarter 2003 Earnings Release and Conference Call

Sep 29, 2003
ParthusCeva, Mentor Graphics and Accelerated Technology Announce Nucleus RTOS Support for Teak DSP Core
Nucleus RTOS Support for ParthusCeva's Teak Addresses Multi Media Processing Applications

Sep 29, 2003
ParthusCeva Announces Architecture Standard for Hybrid DSP/RISC-Based System-on-Chip for ARM Environment
Industry collaboration standardizes the full range of hardware and software interfaces between a CPU and DSP for system-on-chip solutions

Sep 23, 2003
ParthusCeva and AXYS Introduce Multi-Core Verification Support for Teak DSP Core
New MaxLib Teak model enables high speed architecture analysis and software development on virtual Teak multi-core platforms

Sep 16, 2003
ParthusCeva Announces ChannelStream Serial ATA (SATA) Platform
ChannelStream SATA 1.5Gbps PHY and Protocol solution with proven interoperability and silicon performance licensed to leading semiconductor player in high-speed comms

Sep 15, 2003
Renesas Technology Licenses ParthusCeva's TeakLite DSP Core for Cellular Handsets
Renesas Now Shipping TeakLite GSM/GPRS Chips For Next Generation Cellular Handsets

Sep 3, 2003
Infineon Technologies Licenses Parthusceva's TeakLite DSP Core
Parthusceva TeakLite DSP Core powers Infineon's S-GoldLite™ GSM/GPRS wireless single-chip

Aug 6, 2003
US Department of Defense Contracts with ParthusCeva for NavStream™ 3000 GPS Location Technology
US DOD to leverage NavStream's unrivalled accuracy and time-to-location-fix

Jul 22, 2003
ParthusCeva's DSP Cores Licensed by STMicroelectronics for DSL Chipsets
Following acquisition of Tioga Technologies, STMicroelectronics to use ParthusCeva's TeakLite® DSP in multi-channel ADSL and SHDSL chipsets.

Jul 22, 2003
ParthusCeva Announces Results for the Second Quarter Ended June 30, 2003

Jul 14, 2003
ParthusCeva Second Quarter 2003 Earnings Release and Conference Call

Jul 3, 2003
Chip Express Announces Successful Deployment of Structured ASIC Products Incorporating ParthusCeva PLL IP

Jul 3, 2003
eSilicon Announces Successful Deployment of ASIC Chip Incorporating ParthusCeva PLL IP

Jun 24, 2003
Korea's Telson Licenses ParthusCeva's XpertTeak SoC For Cellular Handsets
Telson Utilizing XpertTeak DSP Sub-System for 2.5G and 3G Cellular Terminals

Jun 6, 2003
ParthusCeva Appoints Chet Silvestri as Chief Executive Officer
Appointment strengthens ParthusCeva's US headquarters presence

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