|CEVA in the News|
MOUNTAIN VIEW, Calif., Jan. 7, 2014 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the release of the CEVA-TeakLite-4 v2 DSP architecture, further boosting the performance and lowering the power consumption of the world's most popular DSP architecture for audio/voice applications.
The architectural enhancements incorporated into the CEVA-TeakLite-4 v2 include new power optimization features to the instruction set architecture (ISA) and power scaling unit (PSU) that facilitate even lower power consumption of up to 20%. For further die size optimizations, the latest architecture release enables a reduction in code size of up to 30% for key audio and voice codecs, significantly improving overall system cost. Enhancements also include 50 new instructions, improved 64-bit data processing support, scalable data bandwidth up to 128-bit and a robust system interface that spans from low-power AHB bus to high-performance AXI bus with various master/slave configurations. The CEVA-TeakLite-4 v2 architecture framework is now deployed across the family of CEVA-TeakLite-4 cores, namely the CEVA-TL410, CEVA-TL411, CEVA-TL420 and CEVA-TL421.
"With more than 3 billion CEVA-powered audio and voice devices shipped to date, the CEVA-TeakLite DSP family has been the undisputed industry leader for more than a decade. The CEVA-TeakLite-4 has added to this legacy with more than ten design wins to date, many of which cite the outstanding PPA (power, performance and area) results achieved during evaluation. The latest enhancements that we have introduced as part of the CEVA-TeakLite-4 v2 release provide further PPA optimization and increased performance for audio and voice applications, allowing our customers to truly differentiate any audio/voice enabled product," said Eran Briman, vice president of marketing at CEVA.
The need to support advanced audio and voice functionality in the mobile, consumer electronics and automotive markets continues to expand rapidly as companies adopt new, value-added features such as 'always-on' contextual awareness, active noise cancellation and super wideband voice, all aimed at improving the user experience and differentiating their products. With the release of the CEVA-TeakLite-4 v2 DSP architecture, CEVA has addressed these DSP processing intensive use-cases with further precision and efficiency, while also delivering the highest performance for home entertainment and other advanced HD audio applications.
To further assist customers with system integration of the CEVA-TeakLite-4 DSP cores in Android-based devices, CEVA is providing the AMF (Android Multimedia Framework), a proprietary framework enabling audio tasks to be seamlessly offloaded from CPU to the CEVA-TeakLite-4 DSP, allowing up to 8x in power savings. CEVA will demonstrate AMF running on an Android-based system at CES 2014 in Las Vegas, January 7-10th. To arrange a demonstration, please email firstname.lastname@example.org.
The CEVA-TeakLite-4 is the fourth generation DSP based on the CEVA-TeakLite architecture, the most successful licensable DSP family in the history of the semiconductor industry, with more than 3 billion audio/voice chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice software packages available. The CEVA-TeakLite-4 is offered as a scalable and extensible architecture framework, allowing customers to choose the optimal family member core to address their specific audio/voice application needs. By taking advantage of a unified development infrastructure composed of code-compatible cores, a set of optimized software libraries and a unified tool chain, customers can significantly reduce software development costs while leveraging their software investment in future products. The CEVA-TeakLite-4 DSP is already licensed and in design with multiple licensees, targeting a wide range of markets and applications, including 32-bit audio/voice/sensor processing for mobile, home, and automotive markets. For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in over 1.1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.